E-type Viscometer of this Invention of Electronic Components Glue

This invention relates to electronic parts glue, so you can accurately maintain a distance between the electronic components to connect to the electronic parts, such as two or more semiconductor chips and to provide reliable electronic components, such as semiconductor device manufacturing method of semiconductor laminated body, an electronic parts adhesives, and semiconductor device using electronic parts glue.

In addition to the requirements in recent years, electronic parts such as semiconductor packages start to be compact, have been a growing trend toward three-dimensional installation, a plurality of electronic components is laminated to a multilayer laminated semiconductor body. In addition, the investigations have been carried out to further miniaturization of electronic parts such as semiconductor laminated body.

Semiconductor chip, for example, came to serve as a very thin film, as well as fine wires were formed in the semiconductor. Semiconductor laminated body composed of three-dimensional installation, each semiconductor chip to be layered horizontally without damage.

On the contrary, have traditionally been considered to protect the wires, smaller semiconductor to obtain a reliable semiconductor laminated body, the intermediate spacer between the semiconductor chip to chip method method for semiconductor chips is horizontally laminated, supported or like. As a method of Patent Document 1, for example, reveals a scattered way seals on one semiconductor chip, a semiconductor chip to be laminated face of the formation method of laminating a number of semiconductor chips, and then laminating the other semiconductor.

By setting the viscosity measured at 25 ° C in the above-mentioned range by using the E-type viscometer glue electronic components of this invention using the adhesive for electronic components semiconductor chips using a semiconductor manufacturing glue laminated body, for example, can favorably to the desired shape and glue to keep the other semiconductor lamination adhesive form. In addition, the construction of other semiconductor lamination pressure is caused by an excess amount of glue overflow enough electronic parts, and allows the distance between the semiconductor chip (hereinafter also referred to as the distance between the chips) is basically identical to the particle diameter of each spacer particles.

Electronic parts by the glue of the invention, the lower limit of the viscosity at 1 rpm and 2 times the upper limit is 5 times as high viscosity at 10 revolutions per minute when measured at 25 ° C temperature. E-type viscometer. Less than 2 times the viscosity of hard to stay in shape, drawn up after the invention of the electronic parts of the glue.

The viscosity of greater than 5 times, has a high viscosity adhesive for use in the manufacture of glue laminated semiconductor body within a short distance between the chips, which are difficult to reduce the distance between the particle diameter of the chip as far as each piece of spacer,and allows the distance between the semiconductor chip (hereinafter also referred to as the distance between the chips) is basically identical to the particle diameter of each spacer particles. and marked difficulties, especially when the distance between the chips is 25 microns or less. It is desirable that the upper limit is 3 times high.